- wire-bonding process
- <el.join> ■ Drahtbondverfahren n
English-german technical dictionary. 2013.
wire-bonding process
Schlagen Sie auch in anderen Wörterbüchern nach:
Wire bonding — es el método más usado para llevar a cabo las conexiones entre los circuitos integrados y la placa de circuito impreso (PCB). Sin embargo, la utilidad del método wire bonding no se limita sólo a este tipo de conexiones, ya que también se puede… … Wikipedia Español
Ball bonding — is a type of wire bonding, and is the most common way to make the electrical interconnections between a microchip and the outside world as part of semiconductor device fabrication.Gold or copper wire can be used, though gold is more common… … Wikipedia
Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads … Wikipedia
Gold — This article is about the metal. For the color, see Gold (color). For other uses, see Gold (disambiguation). platinum ← gold → mercury … Wikipedia
Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 … Wikipedia
NaREC — (National Renewable Energy Centre) Type Not for Profit Industry Renewable Energy Energy Efficiency Founded 2002 Founder(s) One North East Headquarters … Wikipedia
Gold-aluminium intermetallics — are intermetallic compounds of gold and aluminium that occur at contacts between the two metals. These intermetallics have different properties than the individual metals which can cause problems in wire bonding in microelectronics. The main… … Wikipedia
Gold plating — is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by chemical or electrochemical means.Mechanical or chemical affixing of thin gold foils onto the surface of objects is instead known as … Wikipedia
Conformal coating — material is applied to electronic circuitry to act as protection against moisture, dust, chemicals, and temperature extremes that, if uncoated (non protected), could result in damage or failure of the electronics to function. When electronics… … Wikipedia
Kirkendall effect — The Kirkendall effect is the migration of markers that occurs when markers are placed at the interface between an alloy and a metal, and the whole is heated to a temperature where diffusion is possible; the markers will move towards the alloy… … Wikipedia
Finetech — Infobox Company company name = Finetech GmbH Co. KG company company type = GmbH Co. KG foundation = 1992 location city = Berlin location country = Germany Headquarters = Berlin key people = Gunter Kuerbis, CEO industry = Engineering products =… … Wikipedia
